发明名称 PLASMA PROCESSING METHOD
摘要 In a plasma treatment of a process gas including chlorine gas, a ceiling member of a silicon material is inhibited from being cut. According to an embodiment of the present invention, a plasma treatment apparatus used in a plasma treatment method includes a treatment container, a mounting member, and a ceiling member. The mounting member supports an object to be treated inside the treatment container. The ceiling member is a member made from the silicon material prepared in the upper portion of the mounting member. The plasma treatment method includes the steps of: bringing the object to be treated into the treatment container; and generating plasma of the treatment gas including the chlorine gas and oxygen gas.
申请公布号 KR20160070711(A) 申请公布日期 2016.06.20
申请号 KR20150175264 申请日期 2015.12.09
申请人 TOKYO ELECTRON LIMITED 发明人 NIITSUMA RYOSUKE;KANAMORI HARUTO
分类号 H01L21/3065;H01L21/02;H01L21/677;H05H1/46 主分类号 H01L21/3065
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