| 发明名称 |
FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer. |
| 申请公布号 |
US2016183363(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201514966099 |
申请日期 |
2015.12.11 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Chang-Jae;KO Tae-Ho;KANG Jun-Ho |
| 分类号 |
H05K1/02;H05K3/00;H05K1/03;B23K26/364;H05K1/09;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flexible printed circuit board having a flexible region and a rigid region, comprising:
an inner board layer; an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region; and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed, wherein the laminate comprises a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer. |
| 地址 |
Suwon-si KR |
