发明名称 HEAT-CONDUCTIVE SILICONE COMPOSITION, CURED PRODUCT, AND COMPOSITE SEAT
摘要 SOLUTION: A heat-conductive silicone composition includes not less than 90% in a total mass part of heat conductive fillers of α-alumina having an α-transformation rate of not less than 90%, and has a weight reduction ratio of less than 1% when kept in atmospheric air at 250°C for 6 hours.EFFECT: The heat-conductive silicone composition obtained using not less than 90% in a total mass part of heat conductive fillers of α-alumina having an α-transformation rate of not less than 90% is little in weight reduction even under 250°C environment, and excellent in heat resistance. The heat-conductive silicone composition, a cured product, and a composite seat are adapted to application to places requiring heat resistance to about 250°C such as heat radiation usages of a semiconductor element using a silicon carbide substrate material, and a vehicle-mounted heater.SELECTED DRAWING: None
申请公布号 JP2016125001(A) 申请公布日期 2016.07.11
申请号 JP20150000836 申请日期 2015.01.06
申请人 SHIN ETSU CHEM CO LTD 发明人 ISHIHARA YASUHISA;ENDO AKIHIRO
分类号 C08L83/04;C08K3/22 主分类号 C08L83/04
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