摘要 |
SOLUTION: A heat-conductive silicone composition includes not less than 90% in a total mass part of heat conductive fillers of α-alumina having an α-transformation rate of not less than 90%, and has a weight reduction ratio of less than 1% when kept in atmospheric air at 250°C for 6 hours.EFFECT: The heat-conductive silicone composition obtained using not less than 90% in a total mass part of heat conductive fillers of α-alumina having an α-transformation rate of not less than 90% is little in weight reduction even under 250°C environment, and excellent in heat resistance. The heat-conductive silicone composition, a cured product, and a composite seat are adapted to application to places requiring heat resistance to about 250°C such as heat radiation usages of a semiconductor element using a silicon carbide substrate material, and a vehicle-mounted heater.SELECTED DRAWING: None |