发明名称 SEMICONDUCTOR FABRICATION APPARATUS FOR METALLIC CVD, TUNGSTEN SILICIDE, AND METHOD FOR FORMING TUNGSTEN LAYER
摘要 PURPOSE: A semiconductor fabrication apparatus for metallic CVD, a tungsten silicide, and a method for forming a tungsten layer are provided to perform selectively a process for forming a tungsten layer and a tungsten silicide process within one apparatus by installing a gas mixing portion and gas flow meters at a shower head and gas supply lines, respectively. CONSTITUTION: A semiconductor substrate(100) is loaded on a substrate support plate. A plurality of process chambers(10) have a shower head(120) for injecting reaction gas, respectively. A gas supply device(20) is installed at the outside of the process chambers(10). The gas supply device(20) supplies plural reaction gases to the shower heads(120) of the process chambers(10). A gas mixing portion(130) is installed at an upper portion of the shower head(120) in order to mix reaction gases of the gas supply device(20) and supply the mixed gases to the shower head(120). A vacuum device is connected with the process chamber(10) in order to maintain a state of low pressure within the process chamber(10). The process chambers(10) are radially arranged within a large-sized chamber(5). A substrate carrier hole(15) is formed on one sidewall of the large-sized chamber(5).
申请公布号 KR20030008331(A) 申请公布日期 2003.01.25
申请号 KR20010043793 申请日期 2001.07.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, YONG HO
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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