发明名称 DIE FOR INJECTION MOLDING, AND MANUFACTURING METHOD OF INJECTION MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a technology for suppressing deformation of a member when the member is taken out after a die is opened, even if the member held at the stationary side of the die is a member different from a resin member in injection molding.SOLUTION: A die 100 for injection molding includes a stationary side die 110 having positioning pins 1a, 1b therein and a movable side die 120 having push-in pins 4a, 4b therein. The positioning pins 1a, 1b are slidably installed along the axial direction and hold a member 9 different from a resin member that is subjected to one-piece molding with the resin member, at the tip side. The push-in pins 4a, 4b are slidably installed along the axial direction and coaxially with the positioning pins 1a, 1b. When the stationary side die 110 and the movable side die 120 are closed together, the push-in pins 4a, 4b are moved to the positioning pins 1a, 1b side, and the positioning pins 1a, 1b are set movable so that the outer peripheral surfaces of the positioning pins 1a, 1b do not contact the different member 9.SELECTED DRAWING: Figure 1
申请公布号 JP2016163966(A) 申请公布日期 2016.09.08
申请号 JP20150044875 申请日期 2015.03.06
申请人 FUJI ELECTRIC CO LTD 发明人 IIKURA ATSUSHI
分类号 B29C33/12;B29C45/14 主分类号 B29C33/12
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