发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 A substrate processing apparatus comprises: a rotation table which is installed in a vacuum container to rotate, and loads a substrate; a first reaction gas supply unit which supplies first reaction gas to the surface of the rotation table; a second reaction gas supply unit which is installed to be separated in an around direction of the rotation table from the first reaction gas supply unit, and supplies second reaction gas reacting with the first reaction gas to the surface of the rotation table; and an activation gas supply unit including a discharge unit which is installed to be separated in the around direction of the rotation table from the first reaction gas supply unit and the second reaction gas supply unit, and supplies activated fluorine-containing gas to the surface of the rotation table, wherein the gas supply unit includes a pipe which is installed on the upstream side more than the discharge unit and supplies fluorine-containing gas to the discharge unit, and one or more hydrogen-containing gas supply units which are installed on the pipe and supply hydrogen-containing gas into the pipe.
申请公布号 KR20160107105(A) 申请公布日期 2016.09.13
申请号 KR20160023460 申请日期 2016.02.26
申请人 TOKYO ELECTRON LIMITED 发明人 MIURA SHIGEHIRO
分类号 H01L21/02;H01L21/205;H01L21/3065;H05H1/46 主分类号 H01L21/02
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