| 主权项 |
1. A control circuit apparatus, comprising:
a substrate; a plurality of barrier circuits mounted on the substrate; a heat-resistant resin configured to cover at least a portion of each of the plurality of barrier circuits; and a filler configured to cover all of the substrate, the plurality of barrier circuits, and the heat-resistant resin, wherein a first compartment in which a first barrier circuit among the plurality of barrier circuits is disposed, and a second compartment adjacent to the first compartment and in which a second barrier circuit different from the first barrier circuit among the plurality of barrier circuits is disposed, are provided on the substrate, wherein the first barrier circuit has a first part and a second part, the first part having a smaller surface area than the second part and a larger maximum calorific value upon a malfunction condition than the second part, and wherein, in the first barrier circuit, the first part is disposed at a position spaced further apart from the second compartment than the second part such that, in a malfunction condition of the first barrier circuit, distances from an outer edge of the second compartment to (i) a point nearest the second compartment of an outer edge of a region in which a temperature of the substrate exceeds an upper limit temperature among rated temperatures of the substrate due to heat generation of the first part and (ii) a point nearest the second compartment of an outer edge of a region in which the temperature of the substrate exceeds the upper limit temperature among the rated temperatures of the substrate due to heat generation of the second part, are equal to each other. |
