| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a solder connection between a conventional chip contact surface and a housing is split or the like due to a difference of thermal expansion coefficients thereof. SOLUTION: A circuit housing comprises a housing bottom having a lower surface carrying a housing contact element contacted with an external unit and an upper surface electrically connected to the circuit contact element of the lower surface of the circuit. The circuit housing further comprises a housing cover provided particularly opposed to the housing bottom. The housing cover elastically presses the circuit having a circuit contact element to the upper surface of the housing bottom. Thus, the split solder connection is eliminated by a small-sized circuit housing having no connection for permanently fixing materials of the circuit contact element and the housing bottom between the circuit contact element and the housing bottom. |
