| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a wire loop which is formed in a high position does not suit with the downsizing of a product and the wire loop which is formed in a low position may cause insulation failure due to the contact or deterioration of quality caused by an increase in bending stress. SOLUTION: When a semiconductor module is manufactured by wire-bonding a semiconductor chip (1) or the like, another wire loop (4) for supporting the wire loop (2) is previously formed for avoiding the contact between the wire loop (2) and components near the loop (2) and for ensuring the desirable height of the wire loop (2). |
