PREPARATION OF MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To enhance positioning accuracy and working efficiency by fitting the projections provided to a lower plate in the positioning holes provided to an inner layer core material to position both of the core material and the lower plate and fitting said projections in the positioning passing holes of an upper plate to place the upper plate on an inner layer core material laminate and laminating and fixing the inner layer core material to prepreg through fixing holes. CONSTITUTION:Positioning passing holes 12b...are opened to a lower plate 12 at four places other than fixing passing holes 12a...and projections 13...are provided to said holes 12b... in an upwardly protruding state. Fixing passing holes 11a... and positioning passing holes 11b... are provided to an upper plate 11. Positioning holes 14b are opened to a laminate 14 along with fixing holes 14a... on the basis of holes for the exposure of a circuit pattern. The laminate 14 is set to the lower plate 12 in a laminated state by fitting the projections 13... of the lower plate 12 in the holes 14b... of the laminate 14 and the upper plate 11 is placed on the laminate so as to fit the projections 13 in the positioning passing holes 11b... and laminated and fixed thereto by the solder or eylet applied to the holes 14a... of the laminate 14 through the fixing passing holes 11a....