| 摘要 |
<p>PURPOSE:To prevent resin flashes generated on the side of a resin body after resin sealing, and form a lead frame by using one resin sealing mold if only the resin shape is the same even with different drawing-lead positions or the different number of leads. CONSTITUTION:In a supporting plate 2 for mounting a semiconductor pellet 3, a lead 5 and a lead 5a connected through a bonding wire 4 are provided with the side adjoining to a surrounding part of a resin sealing region. By the use of the supporting plate 2, resin flashes that flow out of a resin sealing mold can be prevented, and at the same time the lead frame can be formed by using only one mold even with different lead positions or the different number of leads without requiring a groove for alignment with the lead in the mold.</p> |
