| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which the colder dump wherein, requiring no resist, problems of etching damage or the like do not occur, can be provided. SOLUTION: In the method for manufacturing the semiconductor device having the solder dump on a semiconductor substrate, after having formed a metal pattern containing a barrier metal material as a main component by using screen printing in the region for the solder dump on the semiconductor substrate to be formed, the solder dump is formed on this metal pattern. |
