MEASURING METHOD OF WAFER TEMPERATURE,申请号KR19950038235-传众专利搜索

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发明名称	MEASURING METHOD OF WAFER TEMPERATURE
摘要
申请公布号	KR0165463(B1)	申请公布日期	1999.02.01
申请号	KR19950038235	申请日期	1995.10.30
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	SHIN, HWA-SOOK;JI, KYUNG-KOO
分类号	H01J29/70;H01L21/66;(IPC1-7):H01L21/66	主分类号	H01J29/70
代理机构		代理人
主权项
地址

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