发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To enhance heat dissipation effect by providing a standing part integrally with the housing on the inside thereof, bonding a heat dissipating member to the upper surface of the standing part and dissipating heat generated from a heating electronic part through the heat dissipating member and the standing part to the thereby preventing the arranging position of the heat dissipating member from being restricted. SOLUTION: A standing part 11 is provided integrally with a housing 10 on the inside thereof and one end of a heat dissipating member 3 is bonded to the upper surface 11-1 of the standing part 11 by means of a screw 7 while the other end of the heat dissipating member 3 is secured to a board 1 by means of a screw 5. A heating electronic part 2 covered with a thermally conductive rubber 6 is then secured to the heat dissipating member 3 by means of a retaining metal fitting 4 so that heat generated from the heating electronic part 2 is transmitted through the heat dissipating member 3 to the standing part 1 thus cooling the heating electronic part 2. According to the structure, arranging position of the heat dissipating member 3 is not restricted and heat dissipating effect can be enhanced while protecting the heating electronic part 2 against contamination with dust.
申请公布号 JP2000183574(A) 申请公布日期 2000.06.30
申请号 JP19980356435 申请日期 1998.12.15
申请人 TDK CORP 发明人 OYAMA MASAMI;SUNAMI RYOJI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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