| 摘要 |
PROBLEM TO BE SOLVED: To improve the water-wettability of an epoxy resin insulating layer, with rubber elastic particles dispersed, and eliminate through hole plating failure by treating the insulating layer with alkaline solution containing ethanolamine before a plating process. SOLUTION: A prescribed number of prepreg sheets are laminated, and an epoxy resin film is overlaid on both the surfaces of the laminate. Further, copper foil is overlaid on both the surfaces of the laminate, and a laminated plate with both sides clad with copper is manufactured by molding with the application of heat and pressure. Through holes are formed in prescribed positions in the laminated plate with both sides clad with copper, and the laminated plate is immersed in alkaline solution containing ethanolamine. Plating catalyst is supplied and activated, and, following electroless copper plating, electrolytic copper plating is given. Then circuit processing is performed by etching. As a result, wettability to aqueous plating chemicals is improved, and thus occurrences of through hole plating failure can be reduced.
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