| 摘要 |
PROBLEM TO BE SOLVED: To achieve proper heat radiation effect and improve reliability by using a structure, where a heat radiator is superposed when suppressing the temperature increase of a semiconductor electrical heating element that is located on the printed-circuit board of each kind of electrical equipment. SOLUTION: A device is provided with a first heat radiator 1 with improved heat conduction such as aluminum, copper, and iron for releasing heat by mounting a semiconductor electrical heating element 3 and a second heat radiator 2 of the extrusion of an aluminum material for releasing the heat of the first heat radiator 1 by mounting the first heat radiator 1. In this case, an extension part 9, that is extended in steps from a retention part 8 for retaining the first heat radiator 1, is provided at the second heat radiator 2, and the extended part 9 is allowed to extend along the end face of a printed-circuit board 10 from the retention part 8, when the first heat radiator 1 and the second heat radiator 2 are installed at the printed-circuit board 10.
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