FILM-FORMING COMPOSITION AND MATERIAL FOR FORMING INSULATION FILM

摘要

PROBLEM TO BE SOLVED: To provide a film-forming composition for forming a film having excellent heat resistance, a permittivity as low as 2.5 or below (in terms of a specific permittivity), and excellent cracking resistance and suited for use as an interlayer insulation film of,e.g. a semiconductor element. SOLUTION: Provided is a film-forming composition containing a polymer obtained by reacting (A) a compound represented by formula (1) with (B) a compound represented by formula (2) and/or a compound represented by formula (3) and (C) an organic solvent.