| 摘要 |
A substrate processing method for performing development on an exposed resist on a processing target substrate, and an apparatus thereof. A developing solution is supplied to the processing target substrate to fill the solution on the processing target substrate to cause development of the exposed resist on the processing target substrate. The rinse solution is supplied onto a processing surface of the processing target substrate while rotating the processing target substrate, and the rinse solution is supplied onto the backside of the processing target substrate while rotating the processing target substrate.
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