发明名称 |
Method of manufacturing printed wiring boards |
摘要 |
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.
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申请公布号 |
US7325300(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20030468361 |
申请日期 |
2003.08.19 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TATSUMI KIYOHIDE;NISHII TOSHIHIRO;NAKAMURA SHINJI |
分类号 |
H01K3/10;B29C43/18;B29C43/20;B29C43/36;B29C70/68;B30B15/06;H05K3/40;H05K3/46 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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