发明名称 Method of manufacturing printed wiring boards
摘要 In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.
申请公布号 US7325300(B2) 申请公布日期 2008.02.05
申请号 US20030468361 申请日期 2003.08.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TATSUMI KIYOHIDE;NISHII TOSHIHIRO;NAKAMURA SHINJI
分类号 H01K3/10;B29C43/18;B29C43/20;B29C43/36;B29C70/68;B30B15/06;H05K3/40;H05K3/46 主分类号 H01K3/10
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