| 摘要 |
A semiconductor device comprising: a transistor region formed on a semiconductor substrate and having a plurality of memory cell arrays formed of a plurality of memory cell transistors and select transistors one each of which is disposed on one and the other sides of said plurality of memory cell transistors; a diffused layer formed on the surface of said semiconductor substrate between the adjacent first and a second select transistors of said memory cell arrays in said transistor region; a first sidewall film formed on each of the opposed sidewalls of said first and second select transistors adjacent to each other; a second sidewall film formed on said first sidewall film; and a conducting layer formed between said first and second select transistors, so as to contact with said diffused layer, wherein the edge of a contact portion is positioned at a distance no less than the thickness of said second sidewall film from the sidewalls of said first and second select transistors.
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