发明名称 POSITION RECOGNITION DEVICE AND WIRE BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a position recognition device which can accurately conduct the position recognition of each part of semiconductor module and is provided with an illumination system. SOLUTION: The position recognition device 10 is provided with a light source 2, a optical fiber 3 to guide the light from the light source, an arc-shaped illuminating portion 5 to illuminate the light guide from the light source by the optical fiber to the semiconductor module 12, a camera portion 1 to take a photograph of an illuminated portion of the semiconductor module and a controlling portion 8 to recognize a prescribed position of the semiconductor module by an image data taken by the camera portion.
申请公布号 JP2003068788(A) 申请公布日期 2003.03.07
申请号 JP20010251425 申请日期 2001.08.22
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSURUSAKO KOICHI
分类号 H01L21/60 主分类号 H01L21/60
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