| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus with improved light emission, which will not cause heat dissipation problems to be generated due to electrical output crease. <P>SOLUTION: This light-emitting apparatus comprises least two semiconductor chips (12, 14, 16) and one substrate (66). At least one first semiconductor chip (12) is mounted on the substrate (66), and at least one different semiconductor chip (14) is mounted on the first semiconductor chip (12). Each of the semiconductor chips (12, 14; 14, 16) stacked above and below is rotated so that it may shift each other, and each of the semiconductor chips positioned below may have a triangle-shaped emissive surface that is virtually exposed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
