| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a photosemiconductor element, equipped with a high bonding power with a metal member such as a lead frame, etc., and needless to say, a good transparency. <P>SOLUTION: This epoxy resin composition for sealing the photo semiconductor element is provided by containing the following (A) to (D) components and also setting the content ratio of the (D) component in the 0.1 to 2.5 wt.% range based on the total of the epoxy resin composition. (A) At least one of a heterocyclic epoxy resin and a specific aliphatic epoxy resin. (B) A curing agent. (C) A silane-coupling agent. (D) A releasing agent having a molecular structure having a polyethylene structural unit and polyethylene oxide structural unit. The ratio occupied by a structural unit expressed by structural formula (3) [wherein, (n) is a positive number] is set at 25 to 95 wt.% based on the total of the molecular structures constituting the releasing agent. <P>COPYRIGHT: (C)2008,JPO&INPIT |
