发明名称 composição curável e processo para preparar uma composição curável
摘要 A curable composition comprising (A) a resin component, comprising (i) an epoxy compound, (ii) a diluent, and (Hi) a first filler and (B) a hardener component, comprising (iv) a curing agent, (v) a second filler, and (vi) a non-reactive polyether block copolymer additive. The resin component and hardener component each having a viscosity of no greater than 30 Pascal-second under an applied shear of 10 reciprocal seconds at 25 degrees Celsius and the curable composition after 120 seconds of mixing the resin component and hardener component together under an applied shear of 10 reciprocal seconds has a viscosity of at least 100 Pascal-second at 25 degrees Celsius.
申请公布号 BR112012024852(A2) 申请公布日期 2016.06.14
申请号 BR20121124852 申请日期 2011.03.30
申请人 DOW GLOBAL TECHNOLOGIES LLC 发明人 BERND HOEVEL;MATTHIAS KOCH;OLIVER BARLEBEN
分类号 C08G59/00;C09J163/00 主分类号 C08G59/00
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