| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent heat resistance, low linear expansion, and the like, and provide a cured product and an electrical/electronic component.SOLUTION: An epoxy resin composition comprises a compound represented by the following formula (1) (where R-Rindependently represent a hydrogen atom or a monovalent group represented by the formula (2), where at least one monovalent group represented by the formula (2) is present), and a curing agent.SELECTED DRAWING: None |
