| 摘要 |
PROBLEM TO BE SOLVED: To provide: polishing particles for polishing a silicon oxide film, which is used in polishing a silicon oxide film, and which enables the high-speed polishing of a silicon oxide film and the reduction in polishing flaw in the polished silicon oxide film; and a polishing liquid composition for polishing a silicon oxide film, which is arranged by use of such polishing particles.SOLUTION: A group of polishing particles for polishing a silicon oxide film according to the present invention comprises: amorphous silica particles; and crystal ceria particles arranged on the surface of the first particles. According to observation by a transmission type electron microscope, the crystal ceria particles are 5-40 nm in average primary particle diameter. According to observation by the transmission type electron microscope, the amorphous silica particles are preferably 15-300 nm in average primary particle diameter. In the polishing particles for polishing a silicon oxide film, the ceria-to-silica mass ratio (Silica/Ceria) is preferably 0.25-3.0.SELECTED DRAWING: None |
