THE CHIP TRAY DEVICE FOR SEMICONDUCTOR

摘要

The present invention relates to a semiconductor chip tray. According to the present invention, the semiconductor chip tray capable of accommodating and stacking multiple semiconductor chips in multiple layers comprises: a base; a stereobate combined on the upper surface of the base to arrange/form multiple accommodation areas for accommodating the semiconductor chips; at least one first separation prevention protrusion placed on an edge of the receiving area and formed on both horizontal sides of the semiconductor chip; and at least one second separation prevention protrusion placed on the edge of the receiving area and formed on both vertical sides of the semiconductor chip. According to this, components placed on the same plain are manufactured within a permissible tolerance, so the semiconductor chip is prevented from being separated due to the impossibility of manufacturing the semiconductor chip with a completely same level of flatness. Moreover, even if warpage such as twisting or bending due to properties of a tray occurs during use of the semiconductor chip tray, the semiconductor chip is prevented from separation.