| 摘要 |
PROBLEM TO BE SOLVED: To prevent poor connection due to deformation of an IC chip, in a connection body where anisotropic conductive connection of an electronic component, such as an IC chip, is made to a substrate.SOLUTION: A connection structure includes: an electronic component 18 including a first bump array 24 where bumps 23 are arranged along one side edge, and a second bump array 26 where bumps 25 are arranged along the other side edge facing the one side edge; and a substrate 12 having a first terminal array 20 where electrode terminals 19 for connection with the bumps 23 arranged in the first bump array 24 are arranged, a second terminal array 22 where electrode terminals 21 for connection with the bumps 25 arranged in the second bump array 26 are arranged, and protrusions 40 provided between the first and second terminal arrays 20, 22, and supporting an inter-bump array region 30 between the first and second bump arrays 24, 26. The electronic component 18 is pressure-bonded to the substrate 12 via an adhesive 1.SELECTED DRAWING: Figure 2 |
