| 摘要 |
Disclosed are a package-on-package type stack package formed by stacking packages, and a manufacturing method thereof. According to the present invention, the stack package comprises: a bottom package including a first semiconductor chip and first connection members; and a top package placed in the upper part of the bottom package, and including a second semiconductor chip and second connection members electrically connected with the first connection members. The bottom package includes: an interposer including multiple electrodes arranged on an upper edge; multiple first bond fingers arranged as separated from the edge of the interposer; a first semiconductor chip placed on the upper surface of the interposer to expose the electrodes, and including multiple first bonding pads arranged on the upper surface; multiple first bonding wires connecting the first bonding pads with the electrodes; multiple second bonding wires connecting the electrodes with the first bonding fingers; and a first sealing member formed to cover the first bonding fingers, the interposer, the upper and side surfaces of the first semiconductor, and the first and second bonding wires, and including via holes separately exposing parts of the second bonding wires. |
