| 摘要 |
PROBLEM TO BE SOLVED: To provide a moisture-curable resin composition excellent in adhesive force at a high temperature.SOLUTION: The present invention relates to the moisture-curable resin composition containing: an acrylic block copolymer (C) which has a polymer block (A) having a (meth)acrylate unit (a) and a polymer block (B) having a (meth)acrylic acid unit (b) and in which the ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) is 1.0-1.5; and a compound (D) having a moisture-curable functional group.SELECTED DRAWING: None |
