发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To solve the problem that a large amount of a filler such as a filler needs to be contained in order to lower coefficient of linear expansion of a sealing material, when the amount of the filler increases, flowability of the sealing material (resin composition) is lowered, and handling at the time of molding becomes difficult.SOLUTION: A resin composition contains 50 wt.% or more of a filler, and a matrix resin. In the matrix resin, a hydrogen bond term in Hansen parameter is 0.5 or more and 5.0 or less.SELECTED DRAWING: None
申请公布号 JP2016160269(A) 申请公布日期 2016.09.05
申请号 JP20150037013 申请日期 2015.02.26
申请人 MITSUBISHI CHEMICALS CORP 发明人 KIMURA AKINORI;SAITO MASANORI;TANAKA TOSHIYUKI;DAO PHUONG THI KIM;ISOJIMA TAKESHI
分类号 C08L101/00;C08K3/36;C08L63/00;C08L83/04;H01L23/29;H01L23/31 主分类号 C08L101/00
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