| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which has balanced dispersibility, light resistance, transparency and a low coefficient of linear expansion of inorganic particles, and is, particularly, for optical semiconductor application.SOLUTION: A curable resin composition contains 100 pts.mass of organopolysiloxane (I) which has a constitutional unit F1 represented by formula (1) and M1 containing more Si than F1 by one as a unit constituting cyclic organopolysiloxane; and 10-200 pts.mass of inorganic particles. In formula (1), Ris a substituted or unsubstituted C1 to 10 alkyl group, a substituted or unsubstituted C3 to 10 cycloalkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; Ris a C2 to 10 unsaturated bond-containing group; X is a C2 to 10 divalent hydrocarbon group; and a is an integer of 1 or more at a content ratio of the constitutional unit F1.SELECTED DRAWING: None |
