| 摘要 |
An embodiment of the present invention relates to a thermoelectric module. One or more unit cells comprising an N-type first semiconductor device and a P-type second semiconductor device are separated on an identical plate. The first semiconductor device and the second semiconductor device adjacent to the first semiconductor device are respectively electrically connected by a conductive connection part parallel to the plane. A separation space between the unit cells is filled with a thermosetting resin. So, device performance can be improved. |
