MEMORY MODULE AND PRINTED CIRCUIT BOARD USED THERETO

摘要

PURPOSE: A memory module and a printed circuit board used thereto are provided to decrease the size of the memory module by interposing a damping chip among semiconductor memory chips on the printed circuit board. CONSTITUTION: A plurality of memory chips(110) are arranged on a printed circuit board main frame(100) in a longitudinal direction and have a plurality of lead wires. A substrate connector(130) is physically coupled to the memory chips(110) and an external apparatus(200) and supported by the external apparatus(200) to be formed on a side of the printed circuit board main frame(100) in order to electrically transmit and receive signal. A damping chip(120) is installed on a space among the memory chips(110) and eliminates shooting phenomena of electrical signals due to an external noise which can be generated between the substrate connector(130) and the memory chips(110).