MANUFACTURING PROCESS FOR A RADIAL FIN HEAT SINK

摘要

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive base having substantially planar upper and lower surfaces, the upper surface is disposed across from the lower surface, and the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends angularly away from the upper surface of the base. The array has a chamber within to house an air movement device so that the air introduced by the air movement device creates a swirling air movement over the heat exchange portion to increase air movement around the heat exchange portion to enhance the heat extraction from the heat exchange portion.