发明名称 BONDING DEVICE
摘要 PURPOSE:To perform stable wire bonding by a method wherein fed length of a wire is detected to obtain size of gap between the wire and a spark electrode, and a mechanism to make a spark voltage to be changed according to size thereof is added. CONSTITUTION:Varied quantity of fed length of the wire in relation to the reference point of the wire 4 is obtained by detecting variation of the black level on the phot detecting part 10 of an element 7 of charge coupled device (CCD) using a CCD camera 8 consisting of an optical lens 6, a CCD one dimentional sensor 7, and a signal output circuit. Control of the spark voltage is performed according to a detected signal d obtained by this way. Accordingly a ball having the fixed diameter can be formed at the tip part of wire irrelevant to size of gap, and stable bonding can be performed.
申请公布号 JPS5834938(A) 申请公布日期 1983.03.01
申请号 JP19810135280 申请日期 1981.08.27
申请人 NIPPON DENKI KK 发明人 NOGUCHI KAZUYA
分类号 H01L21/60 主分类号 H01L21/60
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