| 摘要 |
PURPOSE:To reduce the number of manufacturing steps and the cost of a product by hardly flowing out undercoating resin from an undercoated region which is formed with a groove extending in an endless shape. CONSTITUTION:After a semiconductor element 14 is secured onto the semiconductor element mounting region 2 of a header 5, the prescribed electrodes of the element 14 are connected via wirings 15 to the inner ends of the leads 8 at both sides, and the element 14 is covered with undercoating resin 16. Since a sharp corner which is produced due to the flowout of resin is not present at the peripheral edge of an undercoated region 4 in this case, the resin does not flow out. After the resin 16 is then hardened, a resin molding region 17 is molded with epoxy resin, and the prescribed part is covered with a resin package 18. Thereafter, unnecessary frame 11 and dam 12 are cut and removed, and a semiconductor device 19 is manufactured. Since the undercoating resin does not override to flow out in the assembly in this manner, the sampling work for flow- out resin can be eliminated. |
