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发明名称
BOND APPLYING DEVICE
摘要
申请公布号
JPH05329420(A)
申请公布日期
1993.12.14
申请号
JP19920134687
申请日期
1992.05.27
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
HIDESE WATARU
分类号
B05C5/00;H05K3/34;(IPC1-7):B05C5/00
主分类号
B05C5/00
代理机构
代理人
主权项
地址
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