| 摘要 |
PROBLEM TO BE SOLVED: To enhance the bond properties of a sealing resin by providing bond regions bringing a substrate and the sealing region into direct contact with one another in the regions outside the connecting parts of the bonding wires but inside the peripheries of the substrate. SOLUTION: A chip element 3 is mounted on almost the central part of a substrate 2 while wiring patterns 4 in a specific shape are formed from almost the central part on the substrate 2 to the peripheries thereof. Next, the wiring patterns 4 and the chip element 3 are connected by bonding wires 5 and then bonding regions S bringing the substrate 2 and a sealing region 7 into direct contact with each other. Through these procedures, the bond properties of the sealing resin 7 can be enhanced even if the sealing resin 7 is released from the substrate 2 due to the thermal shock or with the change over aging.
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