| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which can not only reduce the polishing unevenness, but also can make the equipment in a small size by using a relatively small dummy plate, even though a wide polishing tape is used. SOLUTION: In a polishing device to carry out a sliding sweeping while pressing a polishing tape T to a polished panel W by a contact roller 10 of the horizontal shaft line, the contact roller 10 is not rotated horizontally but driven in the horizontal meandering condition, and the polishing tape is slided in the right angle direction being contacted linearly so as to cleaning-cum- finishing polish the polishing panel W, and furthermore, the contact roller 10 is driven to reciprocate by an endless driving body 18 which is operated under a long circular locus, and thereby, an even polishing and a small size of a dummy plate D are realized. |
