发明名称 THIN FILM DEPOSITING METHOD, BASE MATERIAL, AND THIN FILM DEPOSITING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thin film depositing method in which a dense thin film of excellent quality can be deposited without being influenced by the thickness of a base material, and a thin film depositing device can be operated for a long time. SOLUTION: In the thin film depositing method in which the base material is disposed between electrodes facing each other, the mixture gas including a reactive gas is put in a plasma state by supplying the power between the facing electrodes under the atmospheric pressure or the pressure in the vicinity of the atmospheric pressure, and a thin film is deposited on a surface of the base material, the voltage of the frequency >=1 kHz and <15 kHz is applied to one electrode out of the electrodes facing each other, and the voltage of the frequency >100 kHz and <=150 MHz is applied to the other electrode. The base material is disposed in an almost contact manner with the other electrode on the higher frequency side.
申请公布号 JP2003096569(A) 申请公布日期 2003.04.03
申请号 JP20010292179 申请日期 2001.09.25
申请人 KONICA CORP 发明人 FUKUDA KAZUHIRO;KONDO YOSHIKAZU;TODA YOSHIRO;OISHI KIYOSHI;MIZUNO KO
分类号 H05H1/24;C23C16/509;G02B1/11;H01L21/205 主分类号 H05H1/24
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