| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame which has a highly reliable inner lead having no torsion, and the manufacture of the lead frame. SOLUTION: In this manufacture, the functional face of the inner lead of the lead frame 11 for constituting a semiconductor device 10 by electrically connecting a semiconductor element 15 mounted on a semiconductor mount 12 with the inner lead 14 is compressed (coined), and also the rear of the inner lead is compressed (coined) to the vicinity of the end of a resin-sealing body.</p> |
