POLISHING BOARD AND METHOD

摘要

PROBLEM TO BE SOLVED: To clean a work without forming any flaw in a polishing board and method polishing a thin disk-shaped work such as a silicon wafer. SOLUTION: After polishing, washing fluid S as substitute for working fluid L is discharged from the central part of each machining surface in a space toward the work W, a feed device axially displacing both rotating device disks 24 and 34 is provided to slightly retreat the two rotating device disks 24 and 34. The work W and the rotating device disks 24 and 34 are rotated so as to clean the work W.