发明名称 |
Semiconductor component, especially a submicron or deep submicron DRAM cell, has a deep trench with upper and lower side wall regions separated at a certain depth by an abrupt width increase |
摘要 |
A semiconductor component, with a submicron deep trench having upper and lower side wall regions separated at a certain depth by an abrupt increase in the trench width, is new. A novel semiconductor component comprises a substrate (100) with a deep trench having a depth-dependent width distribution, a width of <= 0.25 mu at the substrate surface and a depth/width ratio of /-15. The trench side wall has upper and lower regions separated at a certain depth by an abrupt increase in the trench width and thus side wall circumference, the upper region containing no oxide ring of /-300 a thickness. Independent claims are also included for the following: (i) a process for producing the above semiconductor component; and (ii) a DRAM cell of <= 0.25 mu nominal size having a deep trench as described above.
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申请公布号 |
DE19938481(A1) |
申请公布日期 |
2000.06.29 |
申请号 |
DE19991038481 |
申请日期 |
1999.08.13 |
申请人 |
MOSEL VITELIC INC., HSINCHU;PROMOS TECHNOLOGIES, INC.;SIEMENS AG |
发明人 |
MEI, LEN |
分类号 |
H01L21/76;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108;H01L21/824 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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