发明名称 LIQUID TREATING DEVICE FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To keep a treating liquid so as not to lower the temp., while the treating liquid spreads on the whole surface of a substrate by supplying hot water to the back surface side of the substrate to heat to accurately control the temp. of the treating liquid supplied to the substrate in a wet process performed by supplying the treating liquid to the substrate as the substrate is rotated. SOLUTION: This treating liquid controlled to a prescribed temp. is supplied to the surface side 10a of the substrate 10 from a liquid supply nozzle and also the hot water is supplied to the back surface side 10b by forming a rotary shaft 12 for rotationally driving the substrate 10 into a hollow rotary shaft and arranging a substrate heating means 60 inside. The substrate heating means 60 is constituted of a hot water tank 61 provided with a heating means, a hot water pipe line 62 and a nozzle tip 63 provided at the tip of the hot water pipe line 62 and in the middle of the hot water pipe line 62, a temp. sensor 64, a pressure control valve 65 and a stop valve 66 are mounted successively from the tip side and plural hot water jetting ports 68 are opened on the conical surface of the nozzle tip 63.
申请公布号 JP2000181072(A) 申请公布日期 2000.06.30
申请号 JP19980354675 申请日期 1998.12.14
申请人 HITACHI ELECTRONICS ENG CO LTD 发明人 WADA NORIYA;AKIBA ISAMU;KIKUCHI YOSHIKI;IZAKI MAKOTO
分类号 B05C11/08;G03F7/16;H01L21/20;(IPC1-7):G03F7/16 主分类号 B05C11/08
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