发明名称 |
LIQUID TREATING DEVICE FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To keep a treating liquid so as not to lower the temp., while the treating liquid spreads on the whole surface of a substrate by supplying hot water to the back surface side of the substrate to heat to accurately control the temp. of the treating liquid supplied to the substrate in a wet process performed by supplying the treating liquid to the substrate as the substrate is rotated. SOLUTION: This treating liquid controlled to a prescribed temp. is supplied to the surface side 10a of the substrate 10 from a liquid supply nozzle and also the hot water is supplied to the back surface side 10b by forming a rotary shaft 12 for rotationally driving the substrate 10 into a hollow rotary shaft and arranging a substrate heating means 60 inside. The substrate heating means 60 is constituted of a hot water tank 61 provided with a heating means, a hot water pipe line 62 and a nozzle tip 63 provided at the tip of the hot water pipe line 62 and in the middle of the hot water pipe line 62, a temp. sensor 64, a pressure control valve 65 and a stop valve 66 are mounted successively from the tip side and plural hot water jetting ports 68 are opened on the conical surface of the nozzle tip 63.
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申请公布号 |
JP2000181072(A) |
申请公布日期 |
2000.06.30 |
申请号 |
JP19980354675 |
申请日期 |
1998.12.14 |
申请人 |
HITACHI ELECTRONICS ENG CO LTD |
发明人 |
WADA NORIYA;AKIBA ISAMU;KIKUCHI YOSHIKI;IZAKI MAKOTO |
分类号 |
B05C11/08;G03F7/16;H01L21/20;(IPC1-7):G03F7/16 |
主分类号 |
B05C11/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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