| 摘要 |
PURPOSE: An apparatus for adhering a circuit tape is provided to prevent a circuit tape from being contaminated by a foreign substrate, by eliminating the foreign substance adhered to a lower surface of a pressured pad by using an adhesive tape. CONSTITUTION: An elevating unit(14) is installed in a frame(12). A slide guide(16) is elevated by the elevating unit and extended in an almost horizontal direction. A slide block(18) is reciprocated between the first and second positions(70,72) by a separate driving unit(20) wherein the positions are separated from each other by a predetermined interval, mounted in the slide guide. A pressuring pad(22) pressures an upper surface of the circuit tape according to the elevation and adheres the circuit tape to a carrier, installed in a lower portion of the slide block. A supporting unit(24) is installed in a lower portion of the first position of the slide block, and the pressured pad adhered to the carrier is disposed on an upper surface of the supporting unit. An adhesive tape(34) is disposed to make its adhesive surface face upward. A cleaning unit(28) is installed in a lower portion of the second position of the slide block. A foreign substance on the pressured pad is eliminated by making the cleaning unit and the adhesive tape closely adhered to a lower surface of the pressured pad.
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