| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive resin composition wherein contamination of IC or the like due to desorption of carbon black caused by contact/wear with molded product and IC or the like is decreased, as the electroconductive resin composition is further made to contain olefinic resins. SOLUTION: In the electroconductive resin composition for IC packaging composed of (A) a polyphenylene ether resin, (B) carbon black, (C) an olefinic resin and (D) a solubilizing agent, this is comprised (a) to contain 1 to 30 pts.wt. of (C) the olefinic resin and 1 to 30 pts.wt. of (D) the hydrogenated resin of styrene-diene block copolymer and/or resin in which styrene is graft- copolymerized with polyolefin as the solubilizing agent to the total of 100 pts.wt. of (A) the polyphenylene ether type resin and (B) the carbon black, and (b) a surface resistivity value of the electroconductive resin composition is 10<2> to 10<10>Ω.
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