| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system capable of improving a film thickness distribution and a coverage distribution without increasing the size of the system. SOLUTION: A substrate holder unit 4 is provided with at least a substrate supporting section on which a substrate 5 is placed, a heater mechanism which is provided in the substrate supporting section and heats the substrate, a cooling mechanism which cools the heater mechanism, a bias applying mechanism which applies bias to the substrate supporting section, a circular arc moving base 65 to which the heater mechanism, the cooling mechanism, and the bias applying mechanism are fixed, and which rotatably supports the substrate supporting section, an eccentric shaft which extends from the circular arc moving base eccentrically with respect to the center of rotation of the substrate supporting section and is freely rotatably supported to a vacuum vessel, a rotating mechanism 40 which is provided to penetrate the eccentric shaft and makes the substrate supporting section revolve, and an circular arc moving mechanism 60 which rotates the eccentric shaft. COPYRIGHT: (C)2007,JPO&INPIT
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