发明名称 Method and a device for bonding two plate-shaped objects
摘要 A method for bonding two plate-shaped objects ( 5 ) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects ( 5 ) with the adhesive in between are transported into a cure chamber ( 11 ) comprising an ultraviolet lamp ( 12 ) and a heating element ( 13 ). A moveable heat-shielding member ( 3 ) is temporary present between the objects ( 5 ) and the heating element ( 13 ) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member ( 3 ) is positioned outside the cure chamber ( 11 ) during a part of the curve treatment.
申请公布号 US7271075(B2) 申请公布日期 2007.09.18
申请号 US20050526191 申请日期 2005.03.01
申请人 KONINKLIJKE PHILIPS ELECTRONICS N.V. 发明人 MAAS HENRICUS GODEFRIDUS RAFAEL;MICHIELSEN THEODORUS MARTINUS;WAELEN RICHARD JOZEF MARIA
分类号 H01L21/30;C09J5/06 主分类号 H01L21/30
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