发明名称 |
Method and a device for bonding two plate-shaped objects |
摘要 |
A method for bonding two plate-shaped objects ( 5 ) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects ( 5 ) with the adhesive in between are transported into a cure chamber ( 11 ) comprising an ultraviolet lamp ( 12 ) and a heating element ( 13 ). A moveable heat-shielding member ( 3 ) is temporary present between the objects ( 5 ) and the heating element ( 13 ) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member ( 3 ) is positioned outside the cure chamber ( 11 ) during a part of the curve treatment.
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申请公布号 |
US7271075(B2) |
申请公布日期 |
2007.09.18 |
申请号 |
US20050526191 |
申请日期 |
2005.03.01 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
MAAS HENRICUS GODEFRIDUS RAFAEL;MICHIELSEN THEODORUS MARTINUS;WAELEN RICHARD JOZEF MARIA |
分类号 |
H01L21/30;C09J5/06 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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