| 摘要 |
A thermally conductive paste is provided to improve heat generation property and storage stability and to lower viscosity so as to allow it to be used for screen printing. A thermally conductive paste comprises a solution A which comprises an acrylate resin and an epoxy resin curing agent; and a solution B which comprises an epoxy resin and an acrylate resin curing agent, wherein a thermally conductive filler is added to at least one of the two solutions in an amount of 100-1,000 parts by weight based on 100 parts by weight of the acrylate resin and the epoxy resin. The solution A and the solution B are mixed in a ratio of 10:90 to 90:10 by weight before use. Preferably the thermally conductive filler is at least one selected from the group consisting of Al2O3, SiO2, C, BN and AlN.
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